vSLAM (Visual Localization and Mapping).Voice activation and audio classification.Object Tracking, Detection and Classification.The development kit includes tools to add the following to your robotics development: Multi-mode microphones are ideal in ‘AlwaysOn' robotic applications where low power, high fidelity, tight sensitivity matching and high acoustic overload point (AOP) are important. The RB3 platform also integrates InvenSense microphones which bring both high SNR and high AOP. The Qualcomm Robotics RB3 Platform also integrates two InvenSense IMU sensors able to quantify external real-time clock measurements to provide a high degree of precision, and includes support for ultra-low noise, industry leading relative accuracy pressure sensor capable of measuring 10 cm of elevation difference. The Qualcomm Robotics RB3 platform can integrate InvenSense's 6-axis IMUs (3-axis gyroscope and 3-axis accelerometer), capacitive barometric pressure sensor, and multi-mode digital microphones. The platform also supports 6-axis inertial measurement unit (IMU 3-axis gyroscope and 3-axis accelerometer), capacitive barometric pressure sensor, multi-mode digital microphones, and additional ports for supplementary sensors from TDK-InvenSense, for example, ultrasonic time-of-flight or gas sensors. These specialized sensors are a part of the new Qualcomm Robotics RB3 Platform from Qualcomm which offers a highly optimized set of hardware, software and tools designed to help manufacturers and developers create advanced consumer, enterprise and industrial robotics products. TDK's InvenSense ICM-42688 motion sensor eliminates critical sensor fusion timing errors, ensuring highly accurate timing of the sensor outputs relative to the clock domain of the new Qualcomm Robotics RB3 platform's fusion engine in the sensor hub. Based on the Qualcomm® SDA/SDM845 system-on-chip (SoC), the Qualcomm Robotics RB3 platform is a comprehensive, highly optimized set of hardware, software and tools designed to help manufacturers and developers create advanced consumer, enterprise and industrial robotics products.Ĭomprised of a comprehensive set of hardware, software, and development tools, the Qualcomm Robotics RB3 platform is designed to help manufacturers and developers create robotic products, ranging from large industrial and enterprise robots to small battery-operated ones with challenging power and thermal dissipation requirements. through its group company, InvenSense, to contribute a product portfolio of MEMS motion and audio sensor solutions to the new Qualcomm Robotics RB3 Platform. TDK Corporation is working with Qualcomm Technologies, Inc.
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